APAC
TSMC 2026 China OIP Ecosystem Forum
TSMC Open Innovation Platform ecosystem forum in Beijing for Chinese chip design teams
About this event
The TSMC 2026 China OIP Ecosystem Forum is the Beijing edition of TSMC's Open Innovation Platform ecosystem events, alongside the Taiwan forum and Japan workshop already listed. TSMC's events page gives the date and city and links to registration. No agenda, speakers or venue have been published.
Who it's for
IC Design EngineersEDA and IP VendorsDesign Service Providers
For the semiconductor design ecosystem around TSMC: chip designers alongside EDA, IP, cloud and design service partners. The regional forum covers design enablement for advanced process nodes, 3DFabric packaging, AI-driven EDA flows and specialty technologies, with customer case studies from OIP partners.